| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a film adhesive that can mount even a semiconductor element composed of an ultrathin chip in a wire embedding structure without causing a void on a joining surface and has excellent heat resistance, moisture resistance and reflow resistance, an adhesive sheet and a semiconductor apparatus manufactured using the film adhesive. <P>SOLUTION: The film adhesive comprises (a) 100 pts.mass of a thermosetting resin containing ≥20 mass% of an epoxy resin having a softening point of ≤100°C and an epoxy equivalent of ≥140 or a phenol resin having a hydroxyl equivalent of ≥140, (b) 30-100 pts.mass of a high-molecular weight component having 3-15% of a crosslinkable functional group on a monomer basis, a weight-average molecular weight of 100,000-800,000 and a Tg of -50 to 50°C, (c) 10-60 pts.mass of an inorganic filler and (d) 0-0.07 pt.mass of a curing accelerator. <P>COPYRIGHT: (C)2013,JPO&INPIT |
