发明名称 |
METHOD OF MANUFACTURING CHIP-STACKED SEMICONDUCTOR PACKAGE |
摘要 |
A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other.
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申请公布号 |
US2012282735(A1) |
申请公布日期 |
2012.11.08 |
申请号 |
US201213439447 |
申请日期 |
2012.04.04 |
申请人 |
AHN JUNG-SEOK;JANG DONG-HYEON;SONG HO-GEON;IM SUNG-JUN;JEON CHANG-SEONG;LEE TEAK-HOON;PARK SANG-SICK |
发明人 |
AHN JUNG-SEOK;JANG DONG-HYEON;SONG HO-GEON;IM SUNG-JUN;JEON CHANG-SEONG;LEE TEAK-HOON;PARK SANG-SICK |
分类号 |
H01L21/82 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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