发明名称 |
FLIP ARM MODULE FOR A BONDING APPARATUS INCORPORATING CHANGEABLE COLLET TOOLS |
摘要 |
An electronic device bonding apparatus comprises a flip arm for picking up an electronic device, the flip arm being operative to invert an orientation of the electronic device. A collet tool which contacts the electronic device and secures it to the flip arm is detachably mountable onto the flip arm, and a bond arm may pick up the electronic device from the collet tool to bond the electronic device to a bonding surface. Additionally, a tool changer module is operative to detach the collet tool from the flip arm and to mount another collet tool onto the flip arm.
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申请公布号 |
US2012279660(A1) |
申请公布日期 |
2012.11.08 |
申请号 |
US201113100713 |
申请日期 |
2011.05.04 |
申请人 |
CHAN CHI FUNG;HUNG KIN YIK;ASM TECHNOLOGY SINGAPORE PTE LTD. |
发明人 |
CHAN CHI FUNG;HUNG KIN YIK |
分类号 |
H05K13/00;B32B37/00;B32B38/18;B32B39/00 |
主分类号 |
H05K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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