THERMAL CONVECTION AND THERMAL CONDUCTION COMBINATION-TYPE HEAT SINK APPARATUS FOR ELECTRONIC DEVICE

摘要

The present invention relates to a thermal convection and thermal conduction combination-type heat sink apparatus for an electronic device, which is simple to manufacture, is economically advantageous, and can effectively dissipate heat which is inside the electronic device. The present invention relates to the heat sink device for dissipating to the outside of the electronic device the heat that is generated from a main board (2), which is seated on the upper surface of the lower plate (1b) of the electronic device (1) comprising an upper plate (1a) and the lower plate (1b), and from a CPU (3), which is seated on the upper surface of the main board (2), and comprises: a heat dissipating plate (10), which further comprises a plate-shaped base (11) that comes into close contact with the upper surface of the main board (2), and a plurality of heat dissipating pins (12) that extendedly protrude upward in a vertical manner from the upper surface of the base (11); and a plate-shaped heat conduction plate (20), which is coupled to the lower surface of the upper plate (1a) of the electronic device (1) so as to be separated away from the upper end portion of the heat dissipating plate (10) at a predetermined distance, thereby aspirating the heat through convection, the heat which is conducted along the heat dissipating pins (12) from the main board (2) and moved vertically upward, and then dissipating the heat to the exterior of the electronic device by means of self-conduction.