| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain an electronic circuit which reduces malfunction of an electronic component while radiating heat of the electronic component. <P>SOLUTION: An electronic circuit includes: a printed board having a ground pattern; an electronic component mounted on the printed board; and a heat sink attached to the printed board so as to contact with the electronic component and radiate heat from the electronic component. The heat sink electrically connects with a ground pattern of the printed substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
