| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that has excellent heat and moisture resistance, has a high elasticity in a cured product at high temperature, and also has excellent hollow-structure maintainability, and a photosensitive film, a pattern forming method, a forming method for hollow structure, and an electronic component using the same. <P>SOLUTION: A photosensitive resin composition comprises (A) a photopolymerizable compound having at least one ethylenically unsaturated group and (B) a photopolymerizable initiator, and contains an oxime ester compound and/or an acylphosphine oxide compound as (B) the photopolymerizable initiator. <P>COPYRIGHT: (C)2013,JPO&INPIT |
