发明名称 FLUID DISPERSION FOR FORMING TRANSPARENT CONDUCTIVE FILM, TRANSPARENT CONDUCTIVE FILM AND METHOD FOR MANUFACTURING TRANSPARENT CONDUCTIVE FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a fluid dispersion for forming a transparent conductive film capable of forming the transparent conductive film which is superior in transparency, conductivity and adhesion strength of a coating film, and to provide the transparent conductive film formed of this fluid dispersion for forming the transparent conductive film and a method for manufacturing the transparent conductive film. <P>SOLUTION: A fluid dispersion for forming a transparent conductive film contains: a precursor of a metal oxide which contains -(C=O)-CH<SB POS="POST">2</SB>-(C=O)-group and is at least one kind selected from the group consisting of an indium oxide, a tin oxide and a zinc oxide; a metal oxide particulate which is at least one kind selected from an Sn-doped indium oxide, an Sb-doped tin oxide, a Zn-doped indium oxide, a Ga doped zinc oxide and an Al doped zinc oxide; and a solvent. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012216550(A) 申请公布日期 2012.11.08
申请号 JP20120083528 申请日期 2012.04.02
申请人 MITSUBISHI MATERIALS CORP;MITSUBIHI MATERIALS ELECTRONIC CHEMICALS CO LTD;AKITA UNIV 发明人 HAGIWARA MASAHIRO;SHIRAISHI SHINYA;YAMAMOTO OSAMU
分类号 H01B1/20;C01G9/00;C01G15/00;C01G19/00;C01G30/00;H01B5/14;H01B13/00 主分类号 H01B1/20
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