MOUNTING STRUCTURE AND METHOD OF CIRCUIT BOARD FOR MULTI-LAYERED CERAMIC CAPACITOR, LAND PATTERN OF CIRCUIT BOARD, PACKING UNIT FOR MULTI-LAYERED CERAMIC CAPACITOR, AND ALIGNING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting structure and mounting method of a circuit board for a multi-layered ceramic capacitor capable of reducing noises generated by vibrations due to a piezoelectric phenomenon, a land pattern of a circuit board for the same, and so on.

SOLUTION: A packing unit 40 for multi-layered ceramic capacitor comprises multi-layered ceramic capacitors 10 which contain internal electrodes and have equal or similar width (WMLCC) and thickness (TMLCC); and a packing sheet 42 including a storing space 45 to contain the multi-layered ceramic capacitors. The internal electrodes of each of the multi-layered ceramic capacitors are horizontally arranged with reference to a bottom surface of the storing space.

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