| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a high frequency circuit board in which the capacitive line pattern can be downsized while enhancing the power handling capability of an inductive line pattern, without causing a discontinuity of the ground surface between connection ends of a strip conductor line. <P>SOLUTION: Since the ground conductor for capacitive lines 4a, 4b, 4c formed on a first dielectric substrate 1, and inductive lines 7a, 7b formed on second dielectric substrates 6a, 6b exists on the top surface of a carrier 2, a discontinuity does not occur on the ground surfaces of them. Since the dielectric constant of the first dielectric substrate is relatively higher than the dielectric constant(-≈10) of a commonly used dielectric substrate, the capacitive lines can be downsized. Furthermore, since an air layer having a dielectric constant substantially equal to 1 exists between the inductive line and the ground surface, the line width of the inductive line can be made as wide as that when a substrate of low dielectric constant is used, and thereby a high power handling capability can be attained. <P>COPYRIGHT: (C)2013,JPO&INPIT |
