| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-beam semiconductor laser device capable of improving production efficiency by increasing tolerance for alignment between electrodes of semiconductor laser elements and the corresponding wiring layers on a sub-mount side when a semiconductor chip in which a plurality of striped semiconductor laser elements are arranged and the sub-mount are bonded. <P>SOLUTION: Wiring layers 31a to 31d are formed on a sub-mount 30. Striped ridge parts R1 to R4 are formed on a semiconductor chip 40. Connection electrode parts 41a to 41d are formed on the ridge parts R1 to R4. A range containing all the striped ridge parts is divided into two blocks in a direction across a stripe direction and further divided into two blocks along the stripe direction, thereby generating a total of four divided regions. One connection electrode part is formed in one divided region. All arrangement positions of the respective connection electrodes are formed to differ in the direction across the stripe direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
