| 摘要 |
<P>PROBLEM TO BE SOLVED: To monitor the injection state during an injection step in which an adhesive is injected into the gap of a laminate wafer. <P>SOLUTION: In the method and device for injecting an adhesive into a gap between wafers, adjoining each other, of a laminate wafer in which a plurality of, at least two, silicon wafers are pasted, an infrared ray having a wavelength that penetrates a silicon wafer constituting the laminate wafer is used for detecting presence of an adhesive in the gap in the laminate wafer, allowing monitoring of injection state during an injection step. The light quantity of reflection light or transmission light is detected, and based on the light quantity, the injection state is detected to determine whether or not injection of the adhesive into the gap has completed. The detection of injection state can be performed during the injection step for injecting the adhesive into the gap of the laminate wafer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
