| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure sensor capable of enhancing bearing strength of a sensor chip and suppressing noise influence on the sensor chip. <P>SOLUTION: Surface orientation of a first plate surface 51 in a first silicon substrate 41, on which respective strain gage resistances 45a to 45d are formed, is (110) plane. The respective strain gage resistances 45a to 45d are arranged so that their longitudinal directions lie along a <110> crystal-axis direction. A plurality of sensor chip side grooves 52a along the <110> crystal-axis direction are formed at a prescribed interval on a second plate surface 52 in a second silicon substrate 42. <P>COPYRIGHT: (C)2013,JPO&INPIT |
