发明名称 Temperature-compensated ohmic resistor for use as current sensor in e.g. semiconductor, has body with surfaces lying one above another and parallel to surface of conductive substrate such that terminals are in contact with body surfaces
摘要 <p>The resistor has a flat body (1) made of material having temperature-compensating properties by a thermal spraying process. First terminal i.e. sinter layer (2), and a second terminal (6) are in contact with lower and upper sides of the body. The body includes surfaces lying one above another and parallel to a surface of a conductive substrate such that the terminals are in contact with the surfaces. The body comprises conducting and insulating layers (8a, 8b) arranged one above another. The insulating layers are arranged against the conductive layers to obtain meander-shaped resistance path.</p>
申请公布号 DE102011100250(A1) 申请公布日期 2012.11.08
申请号 DE201110100250 申请日期 2011.05.03
申请人 DANFOSS SILICON POWER GMBH 发明人
分类号 H01C7/06;G01R19/00;H01C1/14;H01C17/232 主分类号 H01C7/06
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