| 发明名称 |
PROTECTIVE FILM FORMING SHEET AND METHOD FOR FABRICATING SEMICONDUCTOR CHIP |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a protective film forming sheet which has a circuit formed on the surface and can form a protective film in a rear surface inner peripheral part (a region surrounded by an annular-shaped convex part) of a semiconductor wafer having the annular convex part in a rear surface outer peripheral part. <P>SOLUTION: A protective film forming sheet has a protective film formation layer which is formed so as to be releasable on a convex part of a laminate film having a circular convex part. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012216625(A) |
申请公布日期 |
2012.11.08 |
| 申请号 |
JP20110079945 |
申请日期 |
2011.03.31 |
| 申请人 |
LINTEC CORP |
发明人 |
SHINODA TOMONORI;TAKANO TAKESHI |
| 分类号 |
H01L21/304;C09J7/02;C09J201/00 |
主分类号 |
H01L21/304 |
| 代理机构 |
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