| 摘要 |
PURPOSE: A substrate processing system is provided to reduce production costs without using an expensive abrasive material used in a conventional both sides lapping process. CONSTITUTION: A cutting unit(10) cuts an ingot into a wafer shape. A sandblasting unit(50) sprays an abrasive material on at least one side of the cut both sides and sand-blasts the side. A heat treatment unit(30) thermally treats a sand blasted substrate. A polishing unit(40) polishes a front side of the heat treated substrate. A lapping unit(20) laps both sides of the substrate. [Reference numerals] (10) Cutting unit; (20) Wrapping unit; (30) Heat treatment unit; (40) Polishing unit; (50) Sandblasting unit
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