发明名称 Method and apparatus for improving selective soldering
摘要 A method of assessing discrepancy between a target value and a measured value of a parameter of contact area produced between flow of solder ejected from a nozzle and a surface is defined in the present application. This method comprises the steps of: providing a surface of material through which contact area between solder ejected from a nozzle and a side of the surface can be visually detected, for example using a camera; flowing solder through a nozzle and then bringing the solder into contact with a side of the surface, thereby creating contact area between the solder and said side of the surface; detecting the contact area from the other side of the surface so that a value of a parameter of said contact area can then be measured; and assessing any discrepancy between the target value and the measured value so that any necessary compensation in order to achieve the target value can be programmed.
申请公布号 GB201217069(D0) 申请公布日期 2012.11.07
申请号 GB20120017069 申请日期 2012.09.25
申请人 PILLARHOUSE INTERNATIONAL LIMITED 发明人
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