发明名称 Thin film deposition method of the hard substrates and the transparent conductive substrate
摘要 PURPOSE: A method for depositing a thin film of a transparent conductive substrate and a hard board is provided to reduce manufacturing time by forming a thin film on both sides of the hard board and a flexible substrate in one process chamber. CONSTITUTION: A film is supplied from a first roll and is wound around a second roll. A raw material feeding and exhausting nozzle is installed in a direction of 90 degrees of the same plane as the first roll and the second roll. Raw materials are supplied in the direction of 90 degrees of the plane in a progressive direction of the substrate. A line connected to the center of the feeding and exhausting nozzle coincides with the location of a surface with the substrate. Both sides of the transparent hard board and the flexible substrate are coated with ceramic by uniformly supplying raw gas. [Reference numerals] (AA) Supplying mist; (BB) Cooling unit; (CC) Coating unit; (DD) Preheating unit; (EE) Product roll; (FF) Exhaust; (GG) Substrate roll; (HH) Progressive direction of a substrate
申请公布号 KR20120122103(A) 申请公布日期 2012.11.07
申请号 KR20110040093 申请日期 2011.04.28
申请人 发明人
分类号 H01L21/205;C23C16/40;C23C16/44;C23C16/455 主分类号 H01L21/205
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