发明名称 DEVICE AND METHOD FOR THERMOFORMING BY HOT-PLATE HEATING
摘要 A thermoforming device using a hot plate heating includes a frame having a base portion, a peripheral wall portion, and a concave portion; a hot plate having a heating surface and a heating unit heats the heating surface; a decompression unit which is connected to the frame, fixes a sheet to an upper end of the peripheral wall portion of the frame, and decompresses an inner portion of the concave portion covered by the sheet; a decompression unit which is connected to the hot plate and sucks the heating surface side; a unit which is connected to the hot plate and opens the heating surface side to an atmosphere or pressures the heating surface side; an adsorption and heating control unit which performs the adsorption and heating operation of the sheet by the hot plate in a state in which the frame and the hot plate come into close contact with each other with the sheet interposed therebetween; a decompression control unit which performs a decompression operation in the concave portion covered by the sheet; and a molding operation control unit which concurrently performs the adsorption and heating operation and the decompression operation, stops the adsorption and heating operation of the sheet after a predetermined time from the start of the operation, and opens a portion between the hot plate and the sheet to the atmosphere or pressures the portion.
申请公布号 EP2520411(A1) 申请公布日期 2012.11.07
申请号 EP20100840713 申请日期 2010.06.25
申请人 ASANO LABORATORIES CO., LTD. 发明人 TAKAI, TOSHIHIRO;MIZOGUCHI, KENICHI;USAMI, HIDEKI;TERAMOTO, KAZUNORI
分类号 B29C51/10;B29C51/26 主分类号 B29C51/10
代理机构 代理人
主权项
地址