| 摘要 |
PURPOSE: A heat radiation substrate is provided to improve heat radiation properties by discharging conducted heat from light emitting elements to the outside though a heat radiation plate. CONSTITUTION: A printed circuit board(120) is made of a metal material. The printed circuit board mounts a light emitting device on the upper surface. A heat radiation plate(130) is formed on the lower side of the printed circuit board. The heat radiation plate discharges conducted heat of the printed circuit board to the outside. A heat radiation layer(125) is formed on the side of the printed circuit board. |
