发明名称 |
Thermal interface material design for enhanced thermal performance and improved package structural integrity |
摘要 |
An electronic package 100 comprising a semiconductor device 105, a heat spreader layer 110, and a thermal interface material layer 115 located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer 120 having heat conductive particles 125 suspended therein. A portion of the particles are exposed on at least one non-planar surface 135 of the resin layer such that the portion of exposed particles 130 occupies a majority of a total area of a horizontal plane 140 of the non-planar surface. |
申请公布号 |
US8304897(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US201113099145 |
申请日期 |
2011.05.02 |
申请人 |
GURRUM SIVA PRAKASH;HUNDT PAUL J;GUPTA VIKAS;TEXAS INSTRUMENTS INCORPORATED |
发明人 |
GURRUM SIVA PRAKASH;HUNDT PAUL J;GUPTA VIKAS |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|