| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase the efficiency of an LED chip by removing an insulating layer between the LED chip and a heat spreader layer. CONSTITUTION: A through-hole is formed on a base substrate. A wiring pattern layer is formed on one side of the base substrate. A cathode contact unit is in contact with a cathode and an anode. A solder mask layer(221) exposes the cathode contact unit and an anode contact unit. A heat spreader layer(225) is exposed by the through hole.
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