发明名称 |
Semiconductor device having multiple semiconductor elements |
摘要 |
The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface of substrate 100; a process step in which the inner side of substrate 102 is fixed on lower die 130; a process step in which liquid resin 114 is supplied from nozzle 112 onto each of the semiconductor elements in order to cover at least a portion of each of semiconductor chips 102; a process step in which the upper die having plural cavities 144 formed in one surface is pressed onto the lower die, and liquid resin 114 is molded at a prescribed temperature by means of plural cavities 144; and a process step in which cavities 144 of upper die 140 are detached from the substrate, and plural molding resin portions are formed individually.
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申请公布号 |
US8304883(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US201113114554 |
申请日期 |
2011.05.24 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
TAKAHASHI YOSHIMI;AMAGAI MASAZUMI |
分类号 |
H01L23/22;H01L21/00;H05K3/30 |
主分类号 |
H01L23/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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