发明名称 Surface inspection method and surface inspection apparatus
摘要 Light from a light source becomes two illumination beams by a beam splitter. The beams are irradiated onto a semiconductor wafer from two mutually substantially orthogonal azimuthal angles having substantially equal elevation angles to form illumination spots. When the sum of scattered, diffracted, and reflected lights due to the illumination beams is detected, influence of the anisotropy which a contaminant particle and a defect existing in the wafer itself or thereon have with respect to an illumination direction, can be eliminated.
申请公布号 US8305568(B2) 申请公布日期 2012.11.06
申请号 US201113032165 申请日期 2011.02.22
申请人 MATSUI SHIGERU;HACHIYA MASAYUKI;HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 MATSUI SHIGERU;HACHIYA MASAYUKI
分类号 G01N21/88 主分类号 G01N21/88
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