| 摘要 |
PURPOSE: A semiconductor device and a fabrication method thereof are provided to prevent pad peeling which reduces a thickness of a pad by including the pad comprising first and second conductive patterns. CONSTITUTION: A first conductive pattern(32) is formed on a substrate(31). An open part is formed on the substrate. A pad(101) includes a second conductive pattern(35) which is connected to a first conductive pattern. The pad is formed on the first conductive pattern and an interlayer insulating film. A protective film includes a pad open part which partially exposes the second conductive pattern.
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