发明名称 Photosensitive resin composition and circuit formation substrate using the same
摘要 A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).
申请公布号 US8304160(B2) 申请公布日期 2012.11.06
申请号 US20100759475 申请日期 2010.04.13
申请人 MINEGISHI TOMONORI;NOGITA RIKA;KAWASAKI DAI;SUZUKI KEIKO;KONNO TAKU;HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. 发明人 MINEGISHI TOMONORI;NOGITA RIKA;KAWASAKI DAI;SUZUKI KEIKO;KONNO TAKU
分类号 G03F7/00;G03F7/004;G03F7/40 主分类号 G03F7/00
代理机构 代理人
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