发明名称 |
Photosensitive resin composition and circuit formation substrate using the same |
摘要 |
A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B). |
申请公布号 |
US8304160(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20100759475 |
申请日期 |
2010.04.13 |
申请人 |
MINEGISHI TOMONORI;NOGITA RIKA;KAWASAKI DAI;SUZUKI KEIKO;KONNO TAKU;HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. |
发明人 |
MINEGISHI TOMONORI;NOGITA RIKA;KAWASAKI DAI;SUZUKI KEIKO;KONNO TAKU |
分类号 |
G03F7/00;G03F7/004;G03F7/40 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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