发明名称 |
Integrated circuit package with embedded components |
摘要 |
This document discusses, among other things, a semiconductor die package having a first and a second discrete components embedded into a dielectric substrate. An integrated circuit (IC) die is surface mounted on a first side of the dielectric substrate. The semiconductor die package includes a plurality of conductive regions on the second side of the dielectric substrate for mounting the semiconductor die package. A plurality of through hole vias couple the IC die to the first and second discrete components and the plurality of conductive regions.
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申请公布号 |
US8304888(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20090645075 |
申请日期 |
2009.12.22 |
申请人 |
ENGLAND LUKE;HAWKS DOUGLAS;FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
ENGLAND LUKE;HAWKS DOUGLAS |
分类号 |
H01L23/538 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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