发明名称 |
Integrated circuit packaging system with interconnect and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.
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申请公布号 |
US8304921(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20090618417 |
申请日期 |
2009.11.13 |
申请人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ILAGAN ALLAN P.;CABLAO PHILIP LYNDON;STATS CHIPPAC LTD. |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;ILAGAN ALLAN P.;CABLAO PHILIP LYNDON |
分类号 |
H01L23/48;H01L23/52;H01L29/30 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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