发明名称 |
Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
摘要 |
A photosensitive polymer composition, having (a) a polymer selected from polyimide precursors and polyimides having an acid group protected by a protecting group and having no amino group (—NH2) at the end; and (b) a compound that generates an acid when exposed to light and capable of deprotecting the protecting group from the acid group, is employed to form layers of a semiconductor device.
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申请公布号 |
US8304149(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20100961727 |
申请日期 |
2010.12.07 |
申请人 |
NUNOMURA MASATAKA;OOE MASAYUKI;NAKANO HAJIME;TSUMARU YOSHIKO;UENO TAKUMI;HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD.;HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C. |
发明人 |
NUNOMURA MASATAKA;OOE MASAYUKI;NAKANO HAJIME;TSUMARU YOSHIKO;UENO TAKUMI |
分类号 |
G03F7/004;G03F7/027;G03F7/023;G03F7/039;G03F7/30;H05K1/00 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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地址 |
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