发明名称 Semiconductor device and method of manufacturing the same
摘要 There is provided a technology which can allow a semiconductor chip formed with a nonvolatile memory to be sufficiently reduced in size. There is also provided a technology which can ensure the reliability of the nonvolatile memory. In a memory cell of the present invention, a boost gate electrode is formed over a control gate electrode via an insulating film. The boost gate electrode has the function of boosting a voltage applied to a memory gate electrode through capacitive coupling between the boost gate electrode and the memory gate electrode. That is, during a write operation or an erase operation to the memory cell, a high voltage is applied to the memory gate electrode and, to apply the high voltage to the memory gate electrode, the capacitive coupling using the boost gate electrode is subsidiarily used in the present invention.
申请公布号 US8305802(B2) 申请公布日期 2012.11.06
申请号 US20100910788 申请日期 2010.10.23
申请人 KAWASHIMA YOSHIYUKI;HASHIMOTO TAKASHI;RENESAS ELECTRONICS CORPORATION 发明人 KAWASHIMA YOSHIYUKI;HASHIMOTO TAKASHI
分类号 G11C11/34 主分类号 G11C11/34
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