发明名称 |
Heat dissipation structure of electronic device |
摘要 |
A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end. |
申请公布号 |
US8305754(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20100981790 |
申请日期 |
2010.12.30 |
申请人 |
WU HSI-SHENG;CHIANG HSU-CHENG;HUNG KUO-SHU;LIN NENG-TAN;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WU HSI-SHENG;CHIANG HSU-CHENG;HUNG KUO-SHU;LIN NENG-TAN |
分类号 |
H05K7/20;G06F1/20;H01L23/427 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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