发明名称 Manufacture method of semiconductor device
摘要 The disclosure pertains to a semiconductor device and its manufacture method, the semiconductor device including non-volatile memory cells and a peripheral circuit including field effect transistors having an insulated gate. A semiconductor device and its manufacture method are to be provided, the semiconductor device having memory cells with a high retention ability and field effect transistors having an insulated gate with large drive current. The semiconductor device has a semiconductor substrate (1) having first and second areas (AR1, AR2), a floating gate structure (4, 5, 6, 7, 8) for a non-volatile memory cell, a control gate structure (14) formed coupled to the floating gate structure, formed in the first area, and an insulated gate electrode (12, 14) for a logical circuit formed in the second area, wherein the floating gate structure has bird's beaks larger than those of the insulated gate electrode.
申请公布号 US8304310(B2) 申请公布日期 2012.11.06
申请号 US201113026736 申请日期 2011.02.14
申请人 HASHIMOTO HIROSHI;TAKADA KAZUHIKO;FUJITSU SEMICONDUCTOR LIMITED 发明人 HASHIMOTO HIROSHI;TAKADA KAZUHIKO
分类号 H01L21/336;H01L21/28;H01L21/8247;H01L27/115;H01L29/51;H01L29/788;H01L29/792 主分类号 H01L21/336
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