| 摘要 |
PURPOSE: A semiconductor integrated circuit is provided to improve operational reliability by equally loading signals inputted to each semiconductor chip regardless of an order of stacks. CONSTITUTION: A first chip through via transfers a first signal to a second semiconductor chip. The first chip through via is arranged passing through first and second semiconductor chips. First wiring(260) electrically connects a first internal circuit(212). A second chip through via transfers a second signal to the first semiconductor chip. Second wiring(280) electrically connects a second internal circuit(242).
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