发明名称 |
Module and manufacturing method thereof |
摘要 |
A method of manufacturing a module is provided that can alleviate a decrease in cutting yield. This method includes: a step of mounting, on a wiring board having a plurality of mounting regions enclosed by cutting lines on its upper surface, an electronic component in each of the mounting regions; a step of cutting the wiring board along the cutting lines; a step of forming a sealing resin layer so as to seal the electronic component to cover at least part of upper and side surfaces of the cut wiring board; and a step of cutting the sealing resin layer along cut portions (cutting lines) of the cut wiring board. |
申请公布号 |
US8302277(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20080262278 |
申请日期 |
2008.10.31 |
申请人 |
KOGA AKIHIRO;MAKINO SHIGENORI;ROHM CO., LTD. |
发明人 |
KOGA AKIHIRO;MAKINO SHIGENORI |
分类号 |
B23P17/00;H05K3/30;H05K3/36;H05K13/00 |
主分类号 |
B23P17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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