发明名称 |
Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof |
摘要 |
A method of manufacture of a semiconductor packaging system includes: providing a substrate; mounting a semiconductor chip to the substrate; mounting a pillar ball having a ball height electrically connected to the substrate; mounting an interposer above the semiconductor chip and electrically connected to the pillar ball; and wherein: mounting the interposer or mounting the substrate includes connecting the pillar ball to a pillar base having a base height substantially less than the ball height of the pillar ball and the pillar base having vertical sides not covered by the pillar ball.
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申请公布号 |
US8304296(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20100821404 |
申请日期 |
2010.06.23 |
申请人 |
KO CHANHOON;MYUNG JUNWOO;KWON WONIL;STATS CHIPPAC LTD. |
发明人 |
KO CHANHOON;MYUNG JUNWOO;KWON WONIL |
分类号 |
H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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