发明名称 Method and semifinished product for producing an inlay
摘要 The invention relates to a method and a semifinished product for producing an inlay, in particular for chip cards, stored value cards, identification documents, or the like, having at least two electronic components, all electronic components being arranged in a relative configuration on a carrier substrate to implement a component configuration and the component configuration being arranged in a filler material. Furthermore, the invention relates to a method for producing a card having a semifinished product and a card produced using the semifinished product.
申请公布号 US8305764(B2) 申请公布日期 2012.11.06
申请号 US20070279825 申请日期 2007.11.23
申请人 RIETZLER MANFRED;SMARTRAC IP B.V. 发明人 RIETZLER MANFRED
分类号 H05K7/00;H05K1/16;H05K1/18 主分类号 H05K7/00
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