Semiconductor chip thermal interface structures

摘要

Various thermal interface structures and methods are disclosed. In one aspect, a method of manufacturing is provided. The method includes providing plural carbon nanotubes in a thermal interface structure. The thermal interface structure is soldered to a side of a semiconductor chip. In another aspect, an apparatus is provided. The apparatus includes a thermal interface structure that has plural carbon nanotubes. A semiconductor chip is soldered to the thermal interface structure.