Lead frame, method for manufacturing the same and semiconductor device

摘要

A lead frame includes a lead frame body 21 having a die pad 24 to which a semiconductor chip 12 is bonded and a plurality of leads 25 arranged around the die pad 24 and made of Cu or an alloy containing Cu, and a metallic film formed on the lead frame body 21 and to connected to a metallic wire 15 connected to the electrode pad 36 of the semiconductor chip 12. The metallic film is an Ag-plated film 22 with nanoparticles 34 arranged in gaps 33 among Ag crystal grains 31.