发明名称 |
Overcoming laminate warpage and misalignment in flip-chip packages |
摘要 |
An apparatus, system, and method are disclosed for connecting an integrated circuit device to a substrate. A plurality of standard diameter pillars and three or more increased diameter pillars are disposed on an integrated circuit device. The increased diameter pillars have a diameter that is greater than the standard diameter pillars and a height that is similar to the standard diameter pillars. The standard diameter pillars and the increased diameter pillars form a pattern on the integrated circuit device that corresponds to contact pads on a substrate opposite the integrated circuit device. A first group of solder bumps is disposed between the standard diameter pillars and the contact pads. A second group of solder bumps is disposed between the increased diameter pillars and the contact pads. The second group of solder bumps has pre-connection heights that are greater than pre-connection heights of the first group of solder bumps. |
申请公布号 |
US8304290(B2) |
申请公布日期 |
2012.11.06 |
申请号 |
US20090642479 |
申请日期 |
2009.12.18 |
申请人 |
GRAF RICHARD S.;LOMBARDI THOMAS E.;RAY SUDIPTA K.;WEST DAVID J.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GRAF RICHARD S.;LOMBARDI THOMAS E.;RAY SUDIPTA K.;WEST DAVID J. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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