| 摘要 |
PURPOSE: A metal wire for a semiconductor package is provided to reduce manufacturing costs by introducing a wire which has a composite structure. CONSTITUTION: A first wire(300) is made of copper. A dopant layer(305) is included inside the first wire. A second wire includes the dopant layer. The dopant layer is made of materials which have weaker hardness than that of the first wire. The first wire surrounds the outer circumference of the second wire. |
