| 摘要 |
PURPOSE: A non-contact type device for measuring the temperature of infrared rays is provided to reduce distorted infrared rays from being transmitted to an infrared sensor unit by minimizing an intake of the infrared rays because the infrared rays crashing to an inner wall of a light receiving body is reflected by a concavo-convex portion by forming into a surface of the inner wall of the light receiving body into the concavo-convex portion. CONSTITUTION: A non-contact type device for measuring the temperature of infrared rays comprises a casing(10), a light receiving body(20), an infrared sensor(30), and a PCB substrate(40). The light receiving body is installed in the inside of the casing and comprises a light receiving unit(21) and concavo-convex unit(21a). The light receiving unit receives infrared rays being radiated from a measurement object. The concavo-convex unit is formed in an inner periphery of the light receiving unit into a screw-thread form. The infrared sensor is installed in a hole(22) formed in a bottom surface of the light receiving unit, thereby sensing the infrared ray wavelength received by the light receiving unit. The infrared ray sensor converts the sensed infrared ray wavelength into voltage. The PCB substrate is electrically connected to the infrared sensor. The controlling unit is mounted on the PCB substrate. The controlling unit calculates the temperature of the measurement object by comparing the converted voltage and reference voltage.
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