| 摘要 |
PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve production yield by reducing defects due to wire sweeping. CONSTITUTION: A lead frame(110) forms a holding space. The lead frame includes leads(112) which are exposed to the outside. A semiconductor chip(120) is mounted on the holding space of the lead frame. A conductive part connects the lead frame and the semiconductor chip. A molding part molds the semiconductor chip and the conductive part. [Reference numerals] (D1) First direction; (D2) Second direction; (D3) Third direction |
