| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board using laser is provided to form a circuit pattern with a fine line width by forming a seed pattern using laser having a pulse width less than 1 micro second. CONSTITUTION: A substrate(100) is manufactured. The substrate includes a base material and a metal compound. The metal compound is dispersed in the base material. A seed pattern is formed by emitting laser to the substrate. The seed pattern is processed by oxygen plasma. A circuit pattern is formed by electroless-planting the seed pattern. [Reference numerals] (AA) O2 plasma processing |
