| 摘要 |
<p>PURPOSE: A phenoxy resin composition for transparent plastic board is provided to effectively replace glass substrate because of low thermal expansion coefficient because of excellent heat resistance, chemical resistance, and low moisture impregnation and linear thermal expansion coefficient. CONSTITUTION: A phenoxy resin composition comprises a phenoxy resin having a chemical structure indicated in chemical formula 1. A transparent plastic resin using the transparent plastic substrate resin composition is a thin film with a thickness of 0.1-500 micron is coated on a polymer substrate. The waste phenoxy resin composition additionally contains energy ray-curable acrylic oligomer or acrylic polymer resin. The weight average molecular weight of the phenoxy resin composition is 1,000-100,000.</p> |
