发明名称 TEMPERATURE-MEASURING SUBSTRATE AND HEAT TREATMENT APPARATUS
摘要 <p>PURPOSE: A substrate for measuring a temperature and a thermal processing apparatus are provided to easily measure a temperature change under a thermal process by measuring the temperature of a substrate when the substrate is rotated. CONSTITUTION: A processing container(8) is composed of an inner cylinder(4) and an outer cylinder(6). A heating unit(12) heats a substrate received in the processing container. The side part and the ceiling part of the processing container are covered with insulation materials(14). A heating power source(21a-21e) is connected to a feeding line(19). A thermocouple(17a-17e) for a heater is located in a gap between the inner cylinder and the outer cylinder. [Reference numerals] (10) Heating unit; (2) Thermal processing device; (22) Wafer boat(maintaining and supporting unit); (4) Inner cylinder; (40) Gas input device; (46) Temperature control unit; (50a) Substrate for measuring temperature; (52a) Antenna for transceiver; (56) Transceiver; (58) Temperature analyzing unit; (6) Outer cylinder; (8) Processing container; (82) Control unit; (84) Display unit; (86) Memory medium; (AA) Exhaust gas</p>
申请公布号 KR20120120904(A) 申请公布日期 2012.11.02
申请号 KR20120042445 申请日期 2012.04.24
申请人 发明人
分类号 H01L21/66;H01L21/02;H01L21/205 主分类号 H01L21/66
代理机构 代理人
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