RESIN COMPOSITION, RESIN SHEET, PREPREG, LAMINATED BOARD, METAL SUBSTRATE, AND PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having high thermal conductivity and excellent flowability at the same time, and to provide a resin sheet having high thermal conductivity and insulation properties, a prepreg, a laminated board, a metal substrate, and a printed wiring board.

SOLUTION: This resin composition includes a thermosetting resin, a thermally conductive filler and nanoparticles. The thermally conductive filler has an average particle size of 0.2-100 μm calculated from weight accumulation particle size distribution, and the resin composition contains 60-90 vol.% of the thermally conductive filler based on the total solid content of the resin composition. The nanoparticles have an average particle size of 1-100 nm calculated from weight accumulation particle size distribution, and the resin composition contains 0.01-1 vol.% of the nanoparticles based on the total solid content of the resin composition. The resin sheet, the prepreg, the laminated board, the metal substrate, and the printed wiring board are produced using the resin composition.

COPYRIGHT: (C)2013,JPO&INPIT