| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve throughput in the manufacturing of a mold which has a deposition film serving as a mold release layer on its surface. <P>SOLUTION: In a manufacturing of a mold 1 having a deposition film serving as a mold release layer 14 on its surface, an uneven pattern having a desired form is formed in a structure composed of a quartz substrate 10 and a mask layer M by using an etching gas containing deposition gases 5a, 5b. Further, plasma etching is performed on the quartz substrate 10 so that the deposition film formed by the deposit of the deposition gases 5a, 5b is formed along the uneven pattern. <P>COPYRIGHT: (C)2013,JPO&INPIT |
