发明名称 |
LAMINATION SUBSTRATE FOR ELECTRONIC ELEMENT, ELECTRONIC ELEMENT, ORGANIC ELECTROLUMINESCENT DISPLAY DEVICE, ELECTRONIC PAPER, AND MANUFACTURING METHOD OF LAMINATION SUBSTRATE FOR ELECTRONIC ELEMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lamination substrate for an electronic element which simultaneously realizes barrier properties and a narrow picture frame and has excellent heat radiation performance. <P>SOLUTION: This invention relates to a lamination substrate for an electronic element which is used in an electronic element. The lamination substrate for the electronic element has: an insulation layer having an insulation layer through hole; a first conductive part filling the insulation layer through hole; a metal layer formed into a pattern shape on the insulation layer and having an opening on the first conductive part; and a conductive part which is formed in the thickness direction of the lamination substrate for the electronic element, creates electric continuity between a front surface and a rear surface of the lamination substrate for the electronic element, and has at least the first conductive part. The conductive part does not have electrical continuity with the metal layer. The above problem is solved by providing the lamination substrate for the electronic element. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012212522(A) |
申请公布日期 |
2012.11.01 |
申请号 |
JP20110076498 |
申请日期 |
2011.03.30 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
FUKUDA TOSHIHARU;SAKAYORI KATSUYA;ARIHARA KEITA;IIIZUMI YASUHIRO |
分类号 |
H05B33/02;G09F9/30;H01L27/32;H01L51/50;H05B33/04;H05B33/06;H05B33/10 |
主分类号 |
H05B33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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