| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure sensor capable of suppressing reduction of bond strength caused by a spark, and effectively preventing a stress by deformation of a gel member from applying to a diaphragm. <P>SOLUTION: An opening area of a contact part with a gel member in pressure transfer paths (33, 43) is a minimum at an end part on the side of a sensor chip mounting surface (31), and larger than the opening area of the end part and a maximum at the part farthest from a diaphragm (23), and the opening area of an optional position is larger than an opening area at a position closer to the diaphragm (23) than the optional position. A support member (12) includes a first pressure transfer path (33), and has a first support member (30) for fixing a sensor chip (11) to the sensor chip mounting surface (31) through an adhesive (50). The opening area of the contact part with the gel member in the first pressure transfer path (33) is larger at the part farthest from the diaphragm (23) than at the end part on the side of the sensor chip mounting surface (31). <P>COPYRIGHT: (C)2013,JPO&INPIT |
