| 摘要 |
An LED array module is manufactured by: attaching an upper conductive layer to a lower conductive layer by an insulative adhesion layer; forming an insulating layer on the entire exposed surface of the upper conductive layer and the lower conductive layer; forming a plurality of LED mounting regions by machining the upper conductive layer so the upper surface of the lower conductive layer is exposed; mounting an LED in each of the LED mounting regions for supplying power to the LED by the lower and upper conductive layers; charging each of the LED mounting regions with an insulating and transparent resin; and forming respective separation grooves in the upper layer and lower conductive layers abreast in a width direction such that each of the upper and lower conductive layers is divided into a plurality of slices. |
