| 摘要 |
<p>PURPOSE: A semiconductor device for testing a microbump connectivity is provided to easily test an operation of a stacked semiconductor device by directly supporting an access mode. CONSTITUTION: A first boundary scan test block(240) is connected to a microbump block(230) of a channel 0. A second boundary scan test block(241) is connected to a microbump block(231) of a channel 1. A third boundary scan test block(242) is connected to a microbump block(232) of a channel 2. A fourth boundary scan test block(243) is connected to a microbump block(233) of a channel 3. The first to fourth boundary scan test blocks share a scan clock signal, a scan shift signal, and a scan enable signal.</p> |
